Knowledge Themes
India Semiconductor Mission (ISM)
Design Linked Incentive (DLI) Scheme
National Policy on Electronics 2019 (NPE 2019)
Modified Programme for Development of Semiconductors and Display Manufacturing Ecosystem
Semiconductor Fab and Display Fab Schemes
Outsourced Semiconductor Assembly and Test (OSAT)
Assembly Testing Marking and Packaging (ATMP)
Gallium Nitride (GaN) Technology
Electronic Design Automation (EDA) Tools
Chips to Startup (C2S) Programme
India Semiconductor Research Center (ISRC)
SPECS Scheme
Compound Semiconductors and Silicon Photonics
Semiconductor Supply Chain Partnerships (Indo-US
Indo-EU
Indo-Japan)
Structural Subtopics
- India Semiconductor Mission (ISM) objectives and institutional framework
- Modified Programme for Development of Semiconductors and Display Manufacturing Ecosystem
- Fiscal support for Silicon CMOS-based Semiconductor Fabs
- Design Linked Incentive (DLI) Scheme for chipsets and SoCs
- Scheme for Compound Semiconductors and Silicon Photonics
- Semiconductor Assembly Testing Marking and Packaging (ATMP) and OSAT facilities
- Modernization of Semiconductor Laboratory (SCL) in Mohali
- Chips to Startup (C2S) programme for specialized manpower training
- Comparison between ISM 1.0 and ISM 2.0 focus areas
- Strategic importance of semiconductors for national security and telecommunications
- Global semiconductor supply chain vulnerabilities and India's role
- Role of Electronic System Design and Manufacturing (ESDM) under NPE 2019
- Challenges of water and power intensive nature of chip fabrication
- International collaborations and MoUs with partners like US and Japan
- Fiscal support on pari-passu basis and its impact on capital expenditure
Study Material
Full AI-synthesized study material for Semiconductor Industry — India's Chip Policy & Fab Ecosystem is being calibrated.
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